Wave Soldering vs. Reflow Soldering
When working with electronics, there are varying methods for joining metal components together. Through wave soldering, or reflow soldering methods, you can essentially meld two or more components together for use.
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What Is Soldering?
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Soldering is a process that involves using a melted filler alloy, also known as a solder, to join more than one metal piece. During the soldering process, a soldering iron is used to heat the alloy into liquid form so it seeps into the sections being connected reinforcing joints increasing stability. Selecting metals that have a melting point that can be reached using a soldering iron or other soldering systems is a key part of the soldering process. Generally, alloys chosen for solder have a melting point of just under 375 degrees Fahrenheit.
Wave Soldering
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The wave soldering method is the older method used for soldering today.
Completing the process so the final product is the correct proportion and balance means the equipment has to be monitored and adjusted. The main steps of wave soldering include fluxing, preheating and soldering.
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Reflow Soldering
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Following this process, the pieces to be joined are coated with a substance known as soldering paste. Solder paste is made of flux, a cleaning agent and additional solder. The soldering paste holds the pieces together temporarily until it is exposed to the soldering process to melt the solder. Once the pieces to be joined are applied to the particle circuit board, the set is exposed to a wave solder machine with high heat.
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